The result shows that the packaging structure of the microchannel cooler with staggered fins achieves good thermal performance for high power LED arrays. The cooling scheme is optimized by using staggered fins in our microchannel cooler to increase the heat transfer coefficient of the multi-chip LED packaging module.

This may accelerate thermal runaway problems and reduce the reliability of the LED arrays device. However, the results also demonstrates that, without proper design the junction temperature of the module is non-uniform across the LED array, and the downstream or central chips were hotter than the upstream or edge chips. Simulation results, in the form of average die temperature, show that the microchannel cooler reduces the average die temperature, and improves the heat dissipation capability of LED array. The effects are discussed on the cooling of a multi-chip LED module with different internal fin geometries of module, flow velocity and its total power. Detailed thermal performance is analyzed using the FEA (finite element analysis) technology. The packaging structure of a high power LED array integrated with a microchannel cooler is discussed. This paper explores the thermal analysis of high power LED array packaging with a microchannel cooler, which is a relatively new cooling technology. One of key problems is cooling in developing high power LED for illumination.

High-brightness light emitting diodes (LEDs), as a strong candidate for the next generation general illumination applications, were developed by improving luminous efficiency and integrating multichips within limited areas. The efficiency and reliability of solid-state lighting devices strongly depend on successful thermal management. Thermal Analysis of High Power LED Array Packaging with Microchannel Cooler. The results show that better effect of thermal management can get after optimizing layout of bumps, and also show that the more bump number used the better thermal management can get, but there is a best optimal number as there are some other limiting factors such as structure and cost. The effect of the layout and the number of bumps of LED flipchip to thermal management of LED light was analyzed by using FEM simulation. Flipchip s applying is good for improvement of efficiency of light emitting of LED and especially for thermal management. LED solid state lighting (SSL) has a good prospects, but there are some bottlenecks, the one is that efficiency of light emitting is not enough for general lighting, the other is too much heat generated by higher power which affect the efficiency and life of LED. Bump Thermal Management Analysis of LED with Flipchip Package.

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